HEAT-DISSIPATING STRUCTURE APPLIED TO AT LEAST ONE PORTABLE ELECTRONIC DEVICE

摘要

The heat dissipation structure of the present invention includes a support unit and a fan unit disposed in the accommodation space. The support unit has a plane portion, a support portion extending downward from the front side of the plane portion, and a hole passing through the plane portion. The planar portion includes a substrate body, a concave space formed on the top surface of the plane portion, an anti-slip pad detachably received in the concave space, a thin block body disposed on a base of the top surface of the substrate body, and a bottom surface of the substrate body. It has a thin anti-slip body disposed in the base of the. The support portion has a support, an accommodating space formed therein, a plurality of thin holes formed on two opposite side sides of the support, and a thin anti-slip body disposed at the base of the support.