首页> 外国专利> METHOD OF MANUFACTURING INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION ELEMENT CHIP, AND INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION ELEMENT CHIP; METHOD OF MANUFACTURING INTEGRATED THERMOELECTRIC CONVERSION ELEMENT MODULE, AND INTEGRATED THERMOELECTRIC CONVERSION MODULE; AND METHOD OF MANUFACTURING INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION PANEL, AND INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION PANEL

METHOD OF MANUFACTURING INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION ELEMENT CHIP, AND INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION ELEMENT CHIP; METHOD OF MANUFACTURING INTEGRATED THERMOELECTRIC CONVERSION ELEMENT MODULE, AND INTEGRATED THERMOELECTRIC CONVERSION MODULE; AND METHOD OF MANUFACTURING INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION PANEL, AND INTEGRATED AND COUPLED THERMOELECTRIC CONVERSION PANEL

机译:制造集成和耦合的热电转换元件芯片的方法,以及集成和耦合的热电转换元件芯片的方法。制造集成热电转换元件模块的方法,以及集成热电转换模块的方法;和耦合热电转换面板的制造方法和方法,以及耦合和热电转换面板的结合的方法

摘要

PROBLEM TO BE SOLVED: To prevent the function of an entire chip from failing even when a break occurs in some elements in the chip, and to provide a method of manufacturing integrated and coupled thermoelectric conversion element chips more easily.;SOLUTION: The method of manufacturing integrated and coupled thermoelectric conversion element chips includes: a step of forming a first electric insulating material having excellent heat conduction and then forming a pair of a first conductive member and a second conductive member, which have different Seebeck coefficients, on the first electric insulating material; a step of forming a first conductive coupling member and a second conductive coupling member on the first and second conductive members by using a thin-film process; a step of forming a third conductive member and a fourth conductive member on the first and second conductive coupling members so as to form multiple coupled thermoelectric conversion elements; and a final step of joining the multiple coupled thermoelectric conversion elements to each other through a joining conductive member so as to form multiple integrated and coupled thermoelectric conversion element chips. The output ends of the multiple integrated and coupled thermoelectric conversion element chips are connected in series and/or in parallel so as to form multiple modules. The modules are connected so as to obtain a panel/sheet of integrated and coupled thermoelectric conversion elements.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:即使在芯片中的某些元件发生断裂时,也可以防止整个芯片的功能失效,并提供一种更容易制造集成和耦合的热电转换元件芯片的方法。制造集成且耦合的热电转换元件芯片的步骤包括以下步骤:形成具有优异导热性的第一电绝缘材料,然后在第一电绝缘层上形成一对具有不同塞贝克系数的第一导电部件和第二导电部件材料;通过薄膜工艺在第一导电构件和第二导电构件上形成第一导电联接构件和第二导电联接构件的步骤;在第一和第二导电耦合构件上形成第三导电构件和第四导电构件以形成多个耦合的热电转换元件的步骤;最后步骤是通过接合导电构件将多个耦合的热电转换元件彼此接合,以形成多个集成且耦合的热电转换元件芯片。多个集成且耦合的热电转换元件芯片的输出端串联和/或并联连接,以形成多个模块。连接模块以获得集成和耦合的热电转换元件的面板/薄板。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011014850A

    专利类型

  • 公开/公告日2011-01-20

    原文格式PDF

  • 申请/专利权人 KONDO YOSHIOMI;

    申请/专利号JP20090160241

  • 发明设计人 KONDO YOSHIOMI;

    申请日2009-07-06

  • 分类号H01L35/34;H01L35/32;H01L35/14;H02N11;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:01

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