首页> 外国专利> Ethylenically unsaturated group-containing maleimide resin and a manufacturing method thereof, and the photocurable composition and the light-heat-curable composition containing an ethylenically unsaturated group-containing maleimide resin

Ethylenically unsaturated group-containing maleimide resin and a manufacturing method thereof, and the photocurable composition and the light-heat-curable composition containing an ethylenically unsaturated group-containing maleimide resin

机译:含有乙烯性不饱和基团的马来酰亚胺树脂及其制造方法,以及含有乙烯性不饱和基团的马来酰亚胺树脂的光固化性组合物和光热固化性组合物

摘要

PROBLEM TO BE SOLVED: To provide a new maleimide-based resin which forms patterns by photolithography and has an excellent heat resistance.;SOLUTION: The maleimide-based resin containing ethylenic unsaturated groups is obtained by reacting phenolic hydroxyl groups in a maleimide-based resin containing a structure expressed by formula (1), epoxy groups in an ethylenic unsaturated compound containing epoxy groups and/or an unsaturated compound containing isocyanate groups.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种新的马来酰亚胺基树脂,该树脂通过光刻形成图案并具有优异的耐热性。;解决方案:含有烯键式不饱和基团的马来酰亚胺基树脂是通过使马来酰亚胺基树脂中的酚羟基反应而获得的含有式(1)表示的结构,具有环氧基的烯键式不饱和化合物和/或具有异氰酸酯基的不饱和化合物中的环氧基。COPYRIGHT:(C)2007,JPO&INPIT

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