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PACKAGE SUBSTRATE DESIGN DEVICE, PACKAGE SUBSTRATE DESIGN METHOD, AND COMPUTER READABLE RECORDING MEDIUM FOR RECORDING PACKAGE SUBSTRATE DESIGN PROGRAM
PACKAGE SUBSTRATE DESIGN DEVICE, PACKAGE SUBSTRATE DESIGN METHOD, AND COMPUTER READABLE RECORDING MEDIUM FOR RECORDING PACKAGE SUBSTRATE DESIGN PROGRAM
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机译:用于记录包装基质设计程序的包装基质设计设备,包装基质设计方法和计算机可读记录介质
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摘要
According to one embodiment, a package substrate design device includes a first wiring module, a net generator, a second wiring module, and a third wiring module. The first wiring module is configured to generate a plurality of first vias configured to connect wires on the first wiring layer and wires on the second wiring layer and configured to generate a plurality of first wires configured to connect the first vias and the first terminals. The net generator is configured to generate nets for connecting the second terminals and k-th (k is an integer of 1 to (n−2)) vias. The second wiring module is configured to generate a plurality of (k+1)-th vias configured to connect wires on the (k+1)-th wiring layer and wires on the (k+2)-th wiring layer and configured to generate a plurality of (k+1)-th wires configured to connect the (k+1)-th vias and the k-th vias, the (k+1)-th vias and the (k+1)-th wires being generated between the k-th vias and the second terminals connected by the nets. The third wiring module is configured to generate a plurality of n-th wires configured to connect the (n−1)-th vias and the second terminals.
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