Disclosed is a method for manufacturing a transparent conductive film, by which a transparent conductive film containing a titanium oxide (TiO2) material is formed using a sputtering method. The film is formed by sputtering at a film-forming speed of 0.01-1.0 nm/sec using a target which contains a titanium oxide material containing a dopant element at a ratio of 30 mass% or less, in sputtering atmosphere wherein at least 0.1-10 vol% of oxygen is contained and the rest contains an inert gas, then, the film is annealed at a temperature of 250°C or above.
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