Reforming manner, being the reformer and junction manner and reforming

摘要

PROBLEM TO BE SOLVED: To enable a junction having a high reliability by improving a quality on the joint surface of a substrate in an electronic device package.;SOLUTION: The substrate 12 and a cover member 13 are irradiated with Ar neutral beams by neutral beam sources 29 and 30 to perform cleaning, the surfaces of the substrate 12 and the cover member 13 are irradiated with a light by optical fibers 37 and 40, a reflected light from the substrate 12 and the cover member 13 is received and its reflectance is measured by optical-fiber systems 39 and 42. The cleaning of the substrate 12 and the cover member 13 is repeated and the substrate and the cover member are modified until the measured reflectance reaches a fixed quantity or more. When the reflectance reaches the fixed quantity or more, the irradiation of the neutral-beam sources 29 and 30 is completed, the joint surfaces having the high reliability are ensured by joining the modified joint surfaces of the substrate 12 and the cover member 13, and the junction having the high quality is realized, thus obtaining the electronic device package. A throughput can also be improved while ensuring the quality as compared with time management.;COPYRIGHT: (C)2008,JPO&INPIT