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Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis, and manufacture
Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis, and manufacture
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机译:将擦洗痕迹形态和位置的分析应用于半导体测试,分析和制造的评估和校正的方法
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摘要
By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.
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