SUBSTRATE FOR A FLIP CHIP PACKAGE WHICH REDUCES VOID GENERATION BETWEEN THE FLIP CHIP AND A SUBSTRATE AND A MANUFACTURING METHOD OF THE FLIP CHIP PACKAGE USING THE SAME

摘要

PURPOSE: A substrate for a flip chip package and a manufacturing method of the flip chip package using the same are provided to reduce flow rate of a mold resin using a resistance pattern formed on the substrate, thereby uniformly injecting the mold resin on the substrate.;CONSTITUTION: A solder resist layer is formed on a substrate(100). A flip chip(200) is mounted on the upper surface of the solder resist layer. A resistance pattern(120) is formed on a region of the solder resist layer in which the flip chips are not mounted. A hole which exposes a part of a circuit formed on the substrate is formed on the solder resist layer. A pillar made of a cooper material or a solder bump is formed on the lower surface of the flip chip.;COPYRIGHT KIPO 2012