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FILM THICKNESS MEASURING APPARATUS USING INTERFERENCE AND METHOD OF MEASURING FILM THICKNESS USING INTERFERENCE

机译:利用干涉法测量薄膜厚度的装置和利用干涉法测量薄膜厚度的方法

摘要

With a film thickness measuring apparatus of the present invention, a substrate having a transparent film formed on its front surface is placed on a placement unit. A half mirror divides light from a light source such that divided light beams are emitted to the front surface of the substrate and to a reference plane, and overlays reflected light from the front surface of the substrate and reflected light from the reference plane on each other to form interfering light. The interfering light is imaged by an imager. Based on the imaging result, the film thickness of the transparent film is calculated by an arithmetic unit. An optical filter with which an intensity spectrum of transmitted light exhibits a plurality of peaks, the optical filter is disposed between the light source and the half mirror.
机译:对于本发明的膜厚测量装置,将在其前表面上形成有透明膜的基板放置在放置单元上。半反射镜将来自光源的光分开,使得分开的光束发射到基板的前表面和参考平面,并且将来自基板的前表面的反射光和来自参考平面的反射光彼此重叠。形成干涉光。干涉光由成像器成像。基于成像结果,通过算术单元计算透明膜的膜厚度。一种透射光的强度光谱呈现多个峰的滤光器,该滤光器设置在光源和半反射镜之间。

著录项

  • 公开/公告号KR20120113653A

    专利类型

  • 公开/公告日2012-10-15

    原文格式PDF

  • 申请/专利权人 PANASONIC CORPORATION;

    申请/专利号KR20117025493

  • 发明设计人 OIKAZE HIROTOSHI;URASHIMA TAKASHI;

    申请日2010-12-22

  • 分类号G01B11/06;G01B9/02;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:00

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