A process for the preparation of a substrate to substrate core for an electronic assembly

摘要

A process for the adjustment of a substrate (302) with substrate core (308) for an electronic assembly (200, 300), comprising:Drilling of holes (314) in a first region (306) of the conductive substrate core (308);Covering of the holes (314) in the first region (306) with a mask;To build up of conductive paths for directing input - / output signals (e / a - signals) on the substrate core via a second region, andRemoving the mask from the first region (306), in order to expose the holes (314).