Reflow - brazing apparatus having a partition wall with a process chamber of a process for reflow - soldering under use of such a reflow - brazing apparatus

摘要

The invention relates to a reflow soldering device comprising - a process chamber with a feed apparatus for feeding assemblies to be subjected to a heat treatment, - fan devices (28) for feeding an air stream to the circuit boards, - heating devices (35) for heating the air stream. The reflow soldering device further comprises a separating wall (10) disposed in the process chamber, said wall dividing the process chamber in the lateral direction into two process chamber sections (11, 12), wherein the fan devices (28) and the heating devices (35) of the two process chamber sections (11, 12) can be controlled independently of one another so that different temperatures can be established in the process chamber sections (11, 12).