Embodiments of the structures of interconnections svt formed of an insulator and a conductive zone located in the contour and separate from the contour

摘要

The present invention relates to a method of manufacturing an interconnection structure comprising: the formation in a substrate (100) of at least a trench (103, 105) forming a closed contour and of at least one hole (102, 104) situated inside the said closed contour, the trench and the hole being separated by a zone of the substrate, the method furthermore comprising the steps of filling the trench by a dielectric material (111) and of the hole by a conductive material (117, 122).