Method for manufacturing silicon wafer for manufacturing integrated circuits, involves testing chips of wafer, and classifying chips into categories, where chips classified into one category are determined to be non-failure chips

摘要

The method involves testing chips (2, 2') e.g. microprocessor chips, of a wafer, and classifying the chips into two or more categories, where the chips are separated from each other by cutting lines (3, 13). The chips classified into one category are determined to be failure chips and the chips classified into another category are determined to be non-failure chips. Data characteristics of the test result are written in memories of the chips, where the memories are positioned on the cutting lines. Independent claims are also included for the following: (1) a method for manufacturing integrated circuits (2) a device for manufacturing a wafer (3) a device for manufacturing integrated circuits (4) a system for manufacturing integrated circuits.