The chemical mechanical polishing aqueous dispersion for polishing a wiring layer made of copper or copper alloy provided in the electro-optical display device substrate manufacturing method and a chemical mechanical polishing method of the chemical mechanical polishing aqueous dispersion

摘要

PPROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing having excellent polishing performance for metal films such as copper, barrier metal films such as tantalum, and insulation films, and which can be repeatedly used through a simple step; a method of manufacturing an aqueous dispersing element for chemical mechanical polishing; and a chemical mechanical polishing method. PSOLUTION: The aqueous dispersing element for chemical mechanical polishing used for polishing the wiring layer composed of copper or copper alloy disposed on the electrooptic display substrate contains (A) abrasive particles; (B) organic acid; and (C) copper ions. The ratio of a long diameter Rmax of the abrasive particles (A) to their short diameter Rmin, namely Rmax/Rmin, is 1.0 to 1.5. The ingredient (C) is 5.010SP4/SPto 2.010SP5/SPppm. PCOPYRIGHT: (C)2009,JPO&INPIT