首页>
外国专利>
Integrated circuit package including an embedded power stage wherein a first field effect transistor (FET) and a second FET are electrically coupled therein
Integrated circuit package including an embedded power stage wherein a first field effect transistor (FET) and a second FET are electrically coupled therein
展开▼
机译:包括嵌入式功率级的集成电路封装,其中第一场效应晶体管(FET)和第二FET电耦合在其中
展开▼
页面导航
摘要
著录项
相似文献
摘要
One aspect of the invention pertains to an integrated circuit package with an embedded power stage. The integrated circuit package includes a first field effect transistor (FET) and a second FET that are electrically coupled with one another. The FETs are embedded in a dielectric substrate that is formed from multiple dielectric layers. The dielectric layers are laminated together with one or more foil layers that help form an electrical interconnect for the package. Various embodiments relate to method of forming the above package.
展开▼