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Predictive modeling of contact and via modules for advanced on-chip interconnect technology
Predictive modeling of contact and via modules for advanced on-chip interconnect technology
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机译:用于高级片上互连技术的触点和导通模块的预测建模
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摘要
A computer program product estimates performance of a back end of line (BEOL) structure of a semiconductor integrated circuit (IC). Code executes on a computer to dynamically predict an electrical resistance of the BEOL structure based on input data specific to multiple layers of the BEOL structure. The BEOL structure can be a contact or a via. The layers of the contact/via include an inner filling material and an outer liner. The code accounts for a width scatter effect of the inner filling material, as well as a slope profile of the contact/via.
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