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Pattern forming method, use of a resist composition for multiple development, use of a developer for negative development, and use of a rinsing solution for negative development in the pattern forming method.
Pattern forming method, use of a resist composition for multiple development, use of a developer for negative development, and use of a rinsing solution for negative development in the pattern forming method.
A pattern forming method, including: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer; a positive resist composition for multiple development used in the method; a developer for use in the method; and a rinsing solution for negative development used in the method.
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