EPOXY RESIN COMPOSITION FOR SEALING A SEMICONDUCTOR DEVICE WITH EXCELLENT RELIABILITY AND FLEXIBILITY AND EXCELLENT ADHESION TO OTHER MATERIALS IN A SEMICONDUCTOR PACKAGE, AND A SEMICONDUCTOR DEVICE SEALED BY USING THE SAME

摘要

PURPOSE: An epoxy resin composition is provided to obtain excellent frame retardancy without using a frame retardant by comprising an epoxy resin with a specific structure and to have excellent mobility, adhesion and reliability.;CONSTITUTION: An epoxy resin composition comprises an epoxy resin, a hardening agent, a hardening accelerator, and an inorganic filler. As A hydrocarbon-modified novolac structured epoxy resin indicated in chemical formula 1 is used as the epoxy resin. In chemical formula 1, each of R1 and R2 is respectively a hydrogen or a C1-4 linear or branched alkyl group. The average value of n is 1-9. The epoxy resin in chemical formula 1 is 1-13 weight% based on the total weight of the epoxy resin composition.;COPYRIGHT KIPO 2013