ELECTRIC PLATING APPARATUS FOR HORIZONTAL CELLS, AND AN ELECTRO PLATING METHOD CAPABLE OF SUPPRESSING THE FORMATION OF OVER-PLATING

摘要

PURPOSE: An electric plating apparatus for horizontal cells is provided to suppress the formation of over-plating in a side part of a plating object by supplying current only to a back plate from a bus bar.;CONSTITUTION: An electric plating apparatus for horizontal cells consists of a cell frame(100), a plating solution(200), a plurality of back plates(300), a bus bar(500), and an electrode(600). The cell frame forms a plating space where a plating object passes through. The plating solution is placed in the inner plating space and touches the plating object. The back plates are arranged in a second direction which crosses with the first direction, and is supported by the cell frame. The bus bar is connected to the each back plate and supplies current to the back plate. The electrode is supported by the back plate and is arranged inside the plating space. the second direction is a width direction of the plating object.;COPYRIGHT KIPO 2013