METHOD FOR SOLDERING A BALL GRID ARRAY SEMICONDUCTOR PACKAGE CAPABLE OF SIMULTANEOUSLY PERFORMING A LEAD-FREE SOLDERING OPERATION AND A LEAD SOLDERING OPERATION

摘要

PURPOSE: A method for soldering a ball grid array semiconductor package is provided to improve the reliability of a junction surface of the ball grid array semiconductor package by attaching a heat sink to the upper side of the ball grid array semiconductor package with a lead-free ball to easily melt the lead-free solder ball.;CONSTITUTION: A ball grid array semiconductor package(110) is mounted on a mother board by a lead-free solder ball(120). A heat sink(140) is mounted on the upper side of the ball grid array semiconductor package in a reflow process and transmits heat to the lead-free solder ball. The heat sink is cut according to the size of the ball grid array semiconductor package and is received in each lattice space of a lattice tray(150). The heat sink is mounted on the upper side of the ball grid array semiconductor package by a pickup tool(160).;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Working order in equipment; (BB) Pickup again;