首页> 外国专利> METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, A METHOD FOR PROCESSING A SUBSTRATE, A SUBSTRATE PROCESSING APPARATUS, AND A NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM CAPABLE OF IMPROVING THE ETCHING RATE OF HYDROGEN FLUORIDE LIQUID

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, A METHOD FOR PROCESSING A SUBSTRATE, A SUBSTRATE PROCESSING APPARATUS, AND A NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM CAPABLE OF IMPROVING THE ETCHING RATE OF HYDROGEN FLUORIDE LIQUID

机译:制造半导体器件的方法,一种处理基质的方法,一种基质处理设备以及一种非瞬态计算机可读记录介质,该介质可提高氢氟酸液体的刻蚀速率

摘要

PURPOSE: A method for manufacturing a semiconductor device, a method for processing a substrate, a substrate processing apparatus, and a non-transitory computer-readable recording medium are provided to form a nitride layer which has tolerance to hydrogen fluoride at low temperatures.;CONSTITUTION: A process chamber(201) accommodates a substrate(200). A first gas supply system supplies source gas to the substrate in the process chamber. A second gas supply system supplies nitrous gas to the substrate. A third gas supply system supplies hydrogen-containing gas to the substrate. A fourth gas supply system supplies nitrogen gas and inert gas to the substrate. A first nozzle(233a), a second nozzle(233b), and a third nozzle(233c) pass through the lower sidewall of a reaction tube(203).;COPYRIGHT KIPO 2013
机译:用途:提供一种用于制造半导体器件的方法,一种用于处理衬底的方法,一种衬底处理设备以及一种非暂时性计算机可读记录介质,以形成在低温下具有耐氟化氢性能的氮化物层。组成:处理室(201)容纳基板(200)。第一气体供应系统将源气体供应到处理室中的基板。第二气体供应系统将亚氮气体供应至基板。第三气体供应系统将含氢气体供应到基板。第四气体供应系统向基板供应氮气和惰性气体。第一喷嘴(233a),第二喷嘴(233b)和第三喷嘴(233c)穿过反应管(203)的下侧壁。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130038137A

    专利类型

  • 公开/公告日2013-04-17

    原文格式PDF

  • 申请/专利权人 HITACHI KOKUSAI ELECTRIC INC.;

    申请/专利号KR20120105745

  • 发明设计人 OKUDA KAZUYUKI;

    申请日2012-09-24

  • 分类号H01L21/318;H01L21/205;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:22

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