SN-AG ALLOY PLATING SOLUTION FORMING METHOD AND AN SN-AG ALLOY PLATING SOLUTION, SUITABLE FOR IMPROVING CURRENT EFFICIENCY BY MANUFACTURING THE SN-AG ALLOY PLATING SOLUTION AFTER REMOVING IMPURITIES FROM METHANESULPHONIC ACID

摘要

PURPOSE: An Sn-Ag alloy plating solution forming method and an Sn-Ag alloy plating solution are provided to manufacture the Sn-Ag alloy plating solution after removing impurities from methanesulphonic acid, thereby improving current efficiency and maintaining an excellent plating thin film.;CONSTITUTION: An Sn-Ag alloy plating solution forming method comprises: a step of removing impurities from isolated chloride compounds and sulfur compounds existed in methanesulphonic acid; a step of respectively producing methanesulphonic acid Sn and methanesulphonic acid Ag by electrolyzing Sn and Au to the methanesulphonic acid in which the impurities are removed; a step of producing mixed solution by inserting the methanesulphonic acid, the methanesulphonic acid Sn, the methanesulphonic acid Ag, and an additive; and a step of filtering the mixed solution.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Generate refined methanesulphonic acid; (BB) Generate methanesulphonic acid Sn; (CC) Generate methanesulphonic acid Ag; (DD) Generate a mixture solution; (EE) Filter the mixture solution