Diamond coated saw wire for wire saw that is utilized for cutting hard-brittle materials into thin disks for manufacturing silicon wafers of semiconductor, has carbon fiber bundle embedded in hollow wire that is made of steel

摘要

The wire (10) has a core made of a carbon fiber bundle (12) that is formed from carbon fibers (14). Diamond particles are arranged on an external periphery surface of the wire, and the fiber bundle is embedded in a hollow wire (18) that is made of steel. The fiber bundle is arranged around a metallic twisted carrier wire and embedded into a resin matrix. The diamond particles are positively retained in the hollow wire that is manufactured by extrusion process. An internal bore (16) of the hollow wire is formed according to an outer diameter of the fiber bundle. An independent claim is also included for a method for manufacturing a saw wire.