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COVER WAFER OR COMPONENT COVER, WAFER PART OR COMPONENT THAT CAN BE INSERTED USING MICROSYSTEMS TECHNOLOGY, AND SOLDERING METHOD FOR CONNECTING CORRESPONDING WAFER OR COMPONENT PARTS
COVER WAFER OR COMPONENT COVER, WAFER PART OR COMPONENT THAT CAN BE INSERTED USING MICROSYSTEMS TECHNOLOGY, AND SOLDERING METHOD FOR CONNECTING CORRESPONDING WAFER OR COMPONENT PARTS
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机译:可使用微系统技术插入的盖晶圆或零件盖,晶圆零件或零件,以及用于连接对应的晶圆或零件的焊接方法
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摘要
The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) has/have a buffer layer, which has a wetting angle of 35° for a metallic eutectic solution that melts in a range of 265° C. to 450° C. The invention also relates to a component cover having one of the areas which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of a solder material, and to a method for the production thereof.
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