首页> 外国专利> Plassma Enhanced Chemical Vapour Deposition Apparatus And Plassma Enhanced Chemical Vapour Deposition Method

Plassma Enhanced Chemical Vapour Deposition Apparatus And Plassma Enhanced Chemical Vapour Deposition Method

机译:等离子增强化学气相沉积设备和等离子增强化学气相沉积方法

摘要

the present invention provides a plasma chemical vapor deposition apparatus and method help . This device is a vacuum chamber containing a substrate holder for mounting a substrate , one end is disposed to surround the plasma in the interior of the dielectric tube , the dielectric tube is mounted in the through hole formed in the top surface of the vacuum chamber and the RF power being provided dielectric tube the evaporation source comprises providing a metal vapor to the plasma generating section , and the dielectric tube to generate . Metal vapor is passed through the plasma to the substrate is provided with metal - nitride or metal - oxide film to form a ;
机译:本发明提供了等离子体化学气相沉积设备和方法的帮助。该装置是一种真空室,该真空室包含用于安装基板的基板保持器,其一端设置为围绕电介质管内部的等离子体,电介质管安装在真空室顶部表面上形成的通孔中,并且向介电管提供射频功率,蒸发源包括向等离子体产生部分提供金属蒸气,并产生介电管。金属蒸气通过等离子体到达衬底,衬底上形成有金属氮化物或金属氧化物膜;

著录项

  • 公开/公告号KR101456549B1

    专利类型

  • 公开/公告日2014-10-31

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20120099710

  • 申请日2012-09-10

  • 分类号H01L21/205;

  • 国家 KR

  • 入库时间 2022-08-21 15:39:50

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