A method for machining of a device with at least one electric layer structure and device assembly for the machining of a device with at least one electric layer structure

摘要

In various embodiments, a method for processing of a device with at least one electric layer structure (208, 308, 408) is made available, wherein the electrical layer structure (208, 308, 408) a dielectric layer (202, 304, 404) in a physical contact with an electrically conductive layer (110, 204, 302, 402) and the electrical layer structure (208, 308, 408) a first electric conductivity, the method comprising: forming an electrical connection with the dielectric layer (202, 304, 404) of the electric layer structure (208, 308, 408); forming an electrical voltage curve on the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity; and wherein the electrical layer structure (208, 308, 408) according to the degradation of the electrical voltage curve the second electric conductivity.