METHOD FOR DETERMINING ADHESION STRENGTH OF METAL THIN FILM/POLYIMIDE LAMINATE AND METALIZED POLYIMIDE FILM SUBSTRATE USING METAL THIN FILM/POLYIMIDE LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a method for determining the quality of adhesion strength between a metal thin film and a polyimide film in a metal thin film/polyimide laminate in which the metal thin film is laminated on the surface of the polyimide film.;SOLUTION: The adhesion strength is determined to be good when an extreme surface within 100 nm from the surface on the lamination surface side of the polyimide film before lamination is measured by energy loss spectrometry and has a peak at 536 eV. In a metalized polyimide film substrate having copper laminated by electroplating, electroless plating or a method combined with both on the metal thin film of the metal thin film/polyimide laminate using a polyimide film selected by the screening method, an adhesion strength between the metal thin film and the polyimide film is 600 N/m or more.;COPYRIGHT: (C)2015,JPO&INPIT