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method of detecting a specific defect, the detection system and a program of specific defect

机译:检测特定缺陷的方法,检测系统和特定缺陷程序

摘要

PROBLEM TO BE SOLVED: To provide a method, system, and program for more reliably detecting specific defects formed on the surface of a wafer.;SOLUTION: A method for detecting specific defects comprises: a step (S101) of obtaining a light spot map which is the in-plane positional information of light spots detected corresponding to the positions of defects on the surface of a wafer exposed to light; a step (S102) of specifying the determination target region where the specific defects is expected to be formed and the reference region which is a predetermined region other than the determination target region and calculating the ratio of the light spot density of the determination target region to the light spot density of the reference region; and a step (S103) of determining whether the specified defects are present or not based on the calculated ratio value.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种用于更可靠地检测形成在晶片表面上的特定缺陷的方法,系统和程序。解决方案:用于检测特定缺陷的方法包括:获得光斑图的步骤(S101)它是检测到的光斑的面内位置信息,其对应于暴露在光下的晶片表面上的缺陷的位置;步骤(S102),确定将要形成特定缺陷的确定目标区域和除了该确定目标区域以外的预定区域的基准区域,并计算该确定目标区域的光斑密度与参考区域的光斑密度; (S103);以及基于所计算出的比率值来确定是否存在指定缺陷的步骤(S103)。版权:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP5782782B2

    专利类型

  • 公开/公告日2015-09-24

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20110076376

  • 发明设计人 船田 毅;

    申请日2011-03-30

  • 分类号G01N21/956;G01B11/30;G01B11/00;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:07

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