MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFACTURING PRINTED WRING BOARD USING MASK

摘要

A method for manufacturing a printed wiring board includes clamping a mask device at clamping portioned formed in the mask device with a movable clamp device to apply tensile force to the mask device, positioning the mask device over a printed wiring board having connection pads, applying the tensile force to the mask device through the clamping portions such that a mask of the mask device undergoes elastic deformation and positions of opening portions in the mask are vertically aligned relative to positions of the connection pads of the printed wiring board, and loading solder balls through the opening portions in the mask onto the connection pads of the printed wiring board, respectively.