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TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES
TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES
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机译:双侧功率模块的瞬态液相键合过程
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摘要
A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.
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