SURFACE TREATED COPPER FOIL, SURFACE TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER, METHOD FOR MANUFACTURING THE SURFACE TREATED COPPER FOIL, AND METHOD FOR MANUFACTURING THE SURFACE TREATED COPPER FOIL WITH VERY THIN PRIMER RESIN LAYER

摘要

Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m2 to 50 mg/m2 and a tin layer having a thickness by weight of 5 mg/m2 to 40 mg/m2 in this order, and the silane coupling agent layer is provided on the rust-proofing treatment layer is employed. Further, a surface-treated copper foil with a very thin primer resin layer characterized by that a very thin primer resin layer having an equivalent thickness of 1 µm to 5 µm is provided on a bonding surface to the insulating resin substrate of the surface-treated copper foil without roughening treatment according to the present invention is employed.