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Method of removing work-affected layer formed on the surface of a TiAl -based alloy by machining work

机译:通过机加工去除形成在TiAl基合金表面上的工件影响层的方法

摘要

Disclosed is a method of removing a work-affected layer formed on the worked surface of a TiAl-based alloy (base material) by machining work, without exerting any adverse effect on the base material. The method of removing a work-affected layer includes a step of dipping a TiAl-based alloy, having a work-affected layer formed on the surface thereof by machining, in an etchant containing predetermined concentrations of hydrofluoric acid and nitric acid, wherein within the etchant, the concentration of the hydrofluoric acid is not less than 5 g/L and not more than 56 g/L, and the concentration of the nitric acid is selected from within a range from not less than 50 g/L to not more than 260 g/L in accordance with a combination of the concentration of the hydrofluoric acid within the etchant and the etching treatment temperature.
机译:公开了一种通过机械加工去除在TiAl基合金(基材)的加工表面上形成的加工影响层而不对基材产生任何不利影响的方法。去除工作影响层的方法包括以下步骤:将通过加工形成在其表面上形成有工作影响层的TiAl基合金浸入包含预定浓度的氢氟酸和硝酸的蚀刻剂中,其中腐蚀剂,氢氟酸的浓度不小于5g / L且不大于56g / L,硝酸的浓度选自不小于50g / L至不大于50g / L。根据蚀刻剂中氢氟酸的浓度和蚀刻处理温度的组合为260g / L。

著录项

  • 公开/公告号EP2662475B1

    专利类型

  • 公开/公告日2015-05-20

    原文格式PDF

  • 申请/专利权人 MITSUBISHI HEAVY IND LTD;

    申请/专利号EP20130159390

  • 发明设计人 KAMIOKA TAISUKE;

    申请日2013-03-15

  • 分类号C23F1/16;C23G1/10;C23G1/12;C23F1/26;C23F3/06;C23F1/04;

  • 国家 EP

  • 入库时间 2022-08-21 15:06:34

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