首页> 外国专利> DEEP METAL DEPOSITION IN A POROUS MATRIX BY HIGH POWER IMPULSE MAGNETRON SPUTTERING (HIPIMS), POROUS SUBSTRATES IMPREGNATED WITH METAL CATALYST AND USES THEREOF

DEEP METAL DEPOSITION IN A POROUS MATRIX BY HIGH POWER IMPULSE MAGNETRON SPUTTERING (HIPIMS), POROUS SUBSTRATES IMPREGNATED WITH METAL CATALYST AND USES THEREOF

机译:高功率脉冲磁控溅射(HIPIMS)在多孔基体中进行深金属沉积,金属催化剂浸渍的多孔基质及其用途

摘要

The invention concerns porous substrates impregnated with metal catalyst, in particular intended for use as electrodes in a fuel cell such as a proton exchange membrane cell, and method for preparing same. In particular, the present invention concerns a method for impregnating a porous substrate with metal catalyst by high power impulse magnetron sputtering of one or more metal targets, the target(s) and the substrate being placed in an enclosure containing a gaseous plasma medium, the metal of the target(s) being chosen from the transition metals and the alloys of same, said method comprising the following steps: a) applying a pulsed voltage Ut to the target, b) polarising the porous substrate by applying a pulsed voltage Us with a delay Δt relative to the start of step (a).
机译:本发明涉及浸渍有金属催化剂的多孔基材,特别是用作燃料电池如质子交换膜电池中的电极的多孔基材及其制备方法。特别地,本发明涉及一种通过高功率脉冲磁控溅射一种或多种金属靶材而用金属催化剂浸渍多孔基材的方法,所述靶材和所述基材被放置在包含气态等离子体介质的外壳中,从过渡金属及其合金中选择靶的金属,所述方法包括以下步骤:a)向靶施加脉冲电压U t ,b)使多孔质极化通过施加相对于步骤(a)开始的延迟Δt的脉冲电压U s 来形成基板。

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