首页> 外国专利> METHODS FOR PROCESSING HOLES BY MOVING PRECISELY TIMED LASER PULSES IN CIRCULAR AND SPIRAL TRAJECTORIES

METHODS FOR PROCESSING HOLES BY MOVING PRECISELY TIMED LASER PULSES IN CIRCULAR AND SPIRAL TRAJECTORIES

机译:通过在圆形和螺旋形轨迹中移动精确定时的激光脉冲来处理孔的方法

摘要

PROBLEM TO BE SOLVED: To solve the problem of motion constraints impacting the throughput of fine hole processing in high-speed material removal employing a beam positioner for directing a laser beam axis along circular and spiral laser patterns.;SOLUTION: A preferred method of material removal entails causing relative movement between the axis of a beam and a specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory 18 to an entry position 16 within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment 20 of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.;SELECTED DRAWING: Figure 1B;COPYRIGHT: (C)2016,JPO&INPIT
机译:要解决的问题:为解决运动约束问题,该问题使用光束定位器沿圆形和螺旋形激光图案引导激光束轴,来解决高速材料去除中细孔加工的吞吐量问题;解决方案:一种首选的材料加工方法去除必然引起光束轴和样品之间的相对运动,将光束轴以入射段加速度并沿入射轨迹18引导到样品中的入射位置16,在该位置开始发射激光束脉冲,从而移动光束沿样品内的圆周周长加速度移动轴,以沿样品的圆弧段20去除材料,并将入口段加速度设置为小于圆周周长加速度的两倍。;选定的图纸:图1B;版权:(C)2016,日本特许厅

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号