Silica particles, the manufacturing method and semiconductor implementation for the paste

摘要

PROBLEM TO BE SOLVED: To provide silica particles which scarcely discharge α-rays, which is excellent in dispersibility to a resin, and which can be contained in a paste for semiconductor packaging.;SOLUTION: The silica particles have an average particle size of 10 nm to 10 μm measured by dynamic light scattering, wherein the ratio (U/SiO₂) of mass of uranium to mass of silicon oxide (in terms of SiO₂) is 2 ppb or less, the ratio (Th/SiO₂) of mass of thorium to mass of silicon oxide (in terms of SiO₂) is 2 ppb or less, and the ratio (alkali metal element/SiO₂) of mass of alkali metal elements to mass of silicon oxide (in terms of SiO₂) is 10 to 1,000 ppm.;COPYRIGHT: (C)2013,JPO&INPIT