Au-Sn-Ag-BASED SOLDER PASTE, AND ELECTRONIC COMPONENT JOINED OR SEALED USING Au-Sn-Ag-BASED SOLDER PASTE

摘要

Through a solder paste obtained by mixing a solder alloy powder and a flux, the Pb-free Au-Sn-Ag-based solder paste being characterized in that the solder alloy powder contains 27.5% by mass to less than 33.0% by mass of Sn with respect to a total of 100% by mass of the solder alloy powder, and contains 8.0% by mass to 14.5% by mass of Ag, the remainder comprising Au except for elements unavoidably included during manufacturing, the present invention provides a solder paste for high-temperature use, the solder paste not including Pb and comprising an Au-Sn-Ag-based alloy which is markedly inexpensive in comparison with an Au-based solder alloy such as an Au-Sn-based solder alloy, the solder paste having a solidus temperature of approximately 300°C or less which is suitable for such applications as electronic component assembly, and having excellent oxidation resistance and wetting properties as well as workability, stress relaxation characteristics, and reliability.