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PLASMA REACTOR WITH A DYNAMICALLY ADJUSTABLE PLASMA SOURCE POWER APPLICATOR

机译:具有动态可调等离子体源功率施加器的等离子体反应器

摘要

A method for processing a workpiece in a plasma reactor chamber having radially inner and outer source power applicators at a ceiling of the chamber facing the workpiece, the inner and outer source power applicators and the workpiece sharing a common axis of symmetry. The method includes applying RF source power to the source power applicator, and introducing a process gas into the reactor chamber so as to carry out a plasma process on the workpiece characterized by a plasma process parameter, the plasma process parameter having a spatial distribution across the surface of the workpiece. The method further includes rotating at least the outer RF source power applicator about a radial tilt axis to a position at which the spatial distribution of the plasma process parameter has at least a nearly minimal non-symmetry relative to the common axis of symmetry, and translating the inner source power applicator relative to the outer source power applicator along the axis of symmetry to a location at which the spatial distribution has at least a nearly minimal non-uniformity across the surface of the workpiece.
机译:一种用于在等离子体反应器腔室中处理工件的方法,该等离子体反应器腔室在面对工件的腔室的顶部具有径向的内部和外部源功率施加器,内部和外部源功率施加器和工件共享共同的对称轴。该方法包括:将RF源功率施加到源功率施加器;以及将处理气体引入反应器腔室,以便在以等离子体工艺参数为特征的工件上进行等离子体工艺,该等离子体工艺参数在整个等离子体上具有空间分布。工件表面。该方法进一步包括至少使外部RF源功率施加器绕径向倾斜轴旋转到等离子体处理参数的空间分布相对于公共对称轴具有至少几乎最小的非对称的位置,并且进行平移内部源动力施加器相对于外部源动力施加器沿着对称轴到达一个位置,在该位置,空间分布在整个工件表面上具有至少几乎最小的不均匀性。

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