Electric copper plating bath, electro copper plating method, and method of manufacturing electronic part with copper film formed by using the plating bath

摘要

PROBLEM TO BE SOLVED: To achieve both via filling and throwing power for through holes well in electrolytic copper plating and impart excellent flexibility and pliability to the copper film obtained.SOLUTION: An electrolytic copper plating bath contains a bisimidazole derivative in which individual nitrogen atoms of two imidazole rings having an alkyl substituent are bonded together through an alkylene of a specified length, achieving both good via filling and good throwing power for through holes and imparting flexibility and pliability to the copper film obtained.