首页>
外国专利>
Methods to improve BGA package isolation in radio frequency and millimeter wave products
Methods to improve BGA package isolation in radio frequency and millimeter wave products
展开▼
机译:改善射频和毫米波产品中BGA封装隔离度的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method and apparatus are provided for manufacturing a packaged electronic device (200) which includes a carrier substrate (120) in which conductive interconnect paths (122) extend between first and second opposed surfaces, an integrated circuit die (125) affixed to the first surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, and an array of conductors (110), such as BGA, LGA, PGA, C4 bump or flip chip conductors, affixed to the second surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, where the array comprising a signal feed ball (112) and an array of shielding ground balls (111) surrounding the signal feed ball.
展开▼