RESIN COMPOSITION, RESIN COMPOSITION SHEET AND METHOD FOR PRODUCING RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FOIL, B STAGE SHEET, SEMI-CURED RESIN COMPOSITION SHEET WITH METAL FOIL, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD, LED LIGHT SOURCE MEMBER, AND POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in flexibility and flowability when formed in a sheet shape, and exhibits high thermal conductivity and high insulating property when formed in a cured product; a resin composition sheet using the resin composition and a method for producing the resin composition sheet; a resin composition sheet with metal foil; a metal base wiring board material; a metal base wiring board; an LED light source member; and a power semiconductor device.;SOLUTION: There is provided a resin composition which contains (A) an epoxy resin having a biphenyl skeleton, (B) an epoxy resin being a liquid at normal temperature, (C) a phenol resin and (D) an inorganic filler, contains alumina as (D) the inorganic filler, has a content of (D) the inorganic filler of 75 mass% or more in the total solid content, and an oil absorption amount of the total of (D) the contained inorganic filler of 7.5 ml/100 g or less.;SELECTED DRAWING: None;COPYRIGHT: (C)2019,JPO&INPIT