POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS

摘要

POLISHING PADS WITH MULTI-MODAL DISTRIBUTIONS OF PORE DIAMETERS ARE DESCRIBED. METHODS OF FABRICATING POLISHING PADS WITH MULTI-MODAL DISTRIBUTIONS OF PORE DIAMETERS ARE ALSO DESCRIBED. IN AN EXAMPLE, A POLISHING PAD (200, 300, 400, 500, 600, 700, 800) FOR POLISHING A SEMICONDUCTOR SUBSTRATE INCLUDES A HOMOGENEOUS POLISHING BODY. THE HOMOGENEOUS POLISHING BODY INCLUDES A THERMOSET POLYURETHANE MATERIAL AND A PLURALITY OF CLOSED CELL PORES DISPOSED IN THE THERMOSET POLYURETHANE MATERIAL. THE PLURALITY OF CLOSED CELL PORE HAS A MULTI-MODAL DISTRIBUTION OF DIAMETERS. FIGURE 2A