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RRAM DEVICES WITH EXTENDED SWITCHING LAYER AND METHODS OF FABRICATION

机译:具有扩展开关层的RRAM设备及其制造方法

摘要

Approaches for integrating a switching layer that is continuous across an array of RRAM (RRAM) cells and the resulting structures, are described. In an example, a RRAM (RRAM) cell includes an RRAM device coupled to a conductive interconnect disposed in a dielectric layer above the substrate. An RRAM device includes a bottom electrode coupled to an oxygen exchange layer and a top electrode through a switching layer. The switching layer physically extends over the dielectric layer and the bottom electrodes associated with all RRAM devices in a given array. A dielectric spacer film is disposed on the sidewalls of the memory device extending from a lowermost portion of the oxygen exchange layer to the uppermost portion of the top electrode.
机译:描述了用于集成跨RRAM(RRAM)单元的阵列连续的交换层的方法和所得结构。在一个示例中,RRAM(RRAM)单元包括RRAM器件,该RRAM器件耦合到设置在衬底上方的介电层中的导电互连。 RRAM器件包括通过切换层耦合到氧交换层的底部电极和顶部电极。开关层在给定阵列中的所有RRAM器件相关的介电层和底部电极上物理地延伸。电介质隔离膜设置在存储器件的侧壁上,该侧壁从氧交换层的最下部延伸到顶部电极的最上部。

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