首页> 外国专利> SUBSTRATE LOCAL COOLING DEVICE, DEVICE FOR CONTROLLING END PORTION FILM THICKNESS OF FLUIDIZED MATERIAL OF SUBSTRATE IMPARTED WITH THE FLUIDIZED MATERIAL, DEVICE FOR COATING FLUIDIZED MATERIAL, DEVICE FOR DRYING FLUIDIZED MATERIAL IMPARTED ON SUBSTRATE AND METHOD FOR CONTROLLING END PORTION FILM THICKNESS OF FLUIDIZED MATERIAL

SUBSTRATE LOCAL COOLING DEVICE, DEVICE FOR CONTROLLING END PORTION FILM THICKNESS OF FLUIDIZED MATERIAL OF SUBSTRATE IMPARTED WITH THE FLUIDIZED MATERIAL, DEVICE FOR COATING FLUIDIZED MATERIAL, DEVICE FOR DRYING FLUIDIZED MATERIAL IMPARTED ON SUBSTRATE AND METHOD FOR CONTROLLING END PORTION FILM THICKNESS OF FLUIDIZED MATERIAL

机译:基材局部冷却装置,用于控制流态化材料的流态化材料的端部部分薄膜厚度的装置,用于涂布流态化材料的装置,用于将流态化的多孔质化材料用于根据方法进行控制的材料

摘要

To reduce parts with uneven end portion film thickness of a fluidized material that is imparted to a substrate to enlarge the effective area thereof.SOLUTION: In a substrate imparted with a fluidized material, means for cooling an end portion of the fluidized material of a substrate imparted with the fluidized material to temperature lower than the temperature around thereof cools the end portion to a predetermined temperature.SELECTED DRAWING: Figure 1
机译:为了减少带有不平整端部的流化材料的膜厚,以增加其有效面积。赋予流化材料的温度低于其周围温度的温度将端部冷却至预定温度。图1

著录项

  • 公开/公告号JP2019111477A

    专利类型

  • 公开/公告日2019-07-11

    原文格式PDF

  • 申请/专利权人 TORAY IND INC;

    申请/专利号JP20170245910

  • 发明设计人 SAKASHITA RYUTA;TANI YOSHINORI;

    申请日2017-12-22

  • 分类号B05C9/12;B05D3;B05C11/10;B05C5/02;

  • 国家 JP

  • 入库时间 2022-08-21 12:25:30

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