Resin combination, shikishima plating process priming coat, shikishima plating process priming coat and supporter, shikishima plating process priming coat are used for the manufacturing process of wiring board in laminate, and laminate is used for wiring board, multilayer wiring board, and manufactures multilayer wiring board

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board including a primer layer for a plating process, excellent in high adhesive force with electroless plating copper even for a resin surface of small surface roughness, having excellent laser workability.SOLUTION: The multilayer wiring board includes: a primer layer for a process containing (A) a multifunctional epoxy resin, (B) an epoxy resin curative agent, (C) a polybutadiene modified polyamide resin containing a phenolic hydroxyl group, and (D) a silica filler; a prepreg for a wiring board; and an inner layer board provided with a circuit process, disposed in this order.