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Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

机译:电子/电气设备用铜合金,电子/电气设备用可塑性加工的铜合金材料,电子/电气设备的组件,端子和母线

摘要

A copper alloy for an electronic and electric device includes: Mg in a range of 0.1 mass % or more and less than 0.5 mass %; and a Cu balance including inevitable impurities, wherein a graph, in which a vertical axis is dσt/dεt and a horizontal axis is a true strain εt, dσt/dεt being defined by a true stress σt and the true strain εt, obtained in a tensile test of the copper alloy, has a strained region that has a positive slope of dσt/dεt.
机译:用于电子电气设备的铜合金包括:Mg为0.1质量%以上且小于0.5质量%;和包括不可避免的杂质的Cu天平,其中,纵轴为dσ t /dε t ,横轴为真实应变ε t ,dσ t /dε t 由真实应力σ t 和真实应变ε t 的应变区域的斜率为dσ t /dε t

著录项

  • 公开/公告号US10128019B2

    专利类型

  • 公开/公告日2018-11-13

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORPORATION;

    申请/专利号US201615743175

  • 发明设计人 HIROTAKA MATSUNAGA;KAZUNARI MAKI;

    申请日2016-09-08

  • 分类号H01B5/02;H01B1/02;C22F1/08;

  • 国家 US

  • 入库时间 2022-08-21 12:11:41

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