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GATE STACK DESIGN FOR GAN E-MODE TRANSISTOR PERFORMANCE

机译:用于GAN E模式晶体管性能的栅极堆叠设计

摘要

A gate stack structure is disclosed for inhibiting charge leakage in III-V transistor devices. The techniques are particularly well-suited for use in enhancement-mode MOSHEMTs, but can also be used in other transistor designs susceptible to charge spillover and unintended channel formation in the gate stack. In an example embodiment, the techniques are realized in a transistor having a III-N gate stack over a gallium nitride (GaN) channel layer. The gate stack is configured with a relatively thick barrier structure and wide bandgap III-N materials to prevent or otherwise reduce channel charge spillover resulting from tunneling or thermionic processes at high gate voltages. The barrier structure is configured to manage lattice mismatch conditions, so as to provide a robust high performance transistor design. In some cases, the gate stack is used in conjunction with an access region polarization layer to induce two-dimensional electron gas (2DEG) in the channel layer.
机译:公开了一种栅堆叠结构,用于抑制III-V晶体管器件中的电荷泄漏。该技术特别适合用于增强型MOSHEMT,但也可用于其他容易受到电荷溢出和栅极堆叠中意外沟道形成影响的晶体管设计。在示例实施例中,在具有在氮化镓(GaN)沟道层上方的III-N栅堆叠的晶体管中实现该技术。栅极叠层配置有相对较厚的势垒结构和宽带隙III-N材料,以防止或减少由高栅极电压下的隧穿或热电子过程导致的沟道电荷溢出。势垒结构被配置为管理晶格失配条件,从而提供鲁棒的高性能晶体管设计。在某些情况下,栅极叠层与访问区极化层结合使用,以在沟道层中感应二维电子气(2DEG)。

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