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MASKLESS EXPOSURE METHOD, MASKLESS EXPOSURE APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
MASKLESS EXPOSURE METHOD, MASKLESS EXPOSURE APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
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机译:接触不良的方法,接触不良的装置以及使用该接触不良的半导体装置的制造方法
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摘要
A maskless exposure method includes spatially modulating a light output from a light source into a pattern beam having a mask pattern, condensing the modulated pattern beam into a first group of spot beams having a first focal position on a Z-axis substantially perpendicular to an exposure surface of an object layer, and into a second group of spot beams having a second focal position different from the first focal position, and scanning the object layer with the first and second groups of spot beams. The object layer has a first height and a second height different from the first height.
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