首页> 外国专利> SELF-ALIGNED METHOD OF MAKING A TRANSISTOR WITH MULTIPLE NANOWIRE OR NANOSHEET CHANNELS, COMRPISING THE USE OF A SPACER COMPRISING EUV EXPOSED RESIST AS WELL AS NON-EXPOSED RESIST

SELF-ALIGNED METHOD OF MAKING A TRANSISTOR WITH MULTIPLE NANOWIRE OR NANOSHEET CHANNELS, COMRPISING THE USE OF A SPACER COMPRISING EUV EXPOSED RESIST AS WELL AS NON-EXPOSED RESIST

机译:制作具有多个纳米线或纳米片通道的晶体管的自对准方法,包括使用包含EUV曝光电阻和非曝光电阻的垫片

摘要

A method (100) of forming aligned gates for horizontal nanowires or nanosheets, comprising: providing (110) a wafer which comprises at least one fin of sacrificial layers (4) alternated with functional layers (3), and a dummy gate (1) covering a section of the fin between a first end (21) and a second end (22); at least partly removing (120) the sacrificial layers (4) at the first end (21) and the second end (22) thereby forming a void between the functional layers at the first and end (21, 22) such that the void is partly covered by the dummy gate; providing (130) resist material which oxidizes upon EUV exposure; exposing (140) the wafer to EUV light; selectively removing part of the unexposed resist (6) and removing (150) the dummy gate and the unexposed resist (5); forming (160) a gate between the functional layers and between the remaining parts of exposed resist (6) at the first end (21) and at the second end (22).
机译:一种形成用于水平纳米线或纳米片的对准栅极的方法(100),包括:提供(110)晶片,该晶片包括至少一个牺牲层(4)的鳍片和功能层(3)交替,以及伪栅极(1)在第一端(21)和第二端(22)之间覆盖翅片的一部分;在第一端(21)和第二端(22)上至少部分地去除(120)牺牲层(4),从而在第一端和端(21、22)的功能层之间形成空隙,使得该空隙为被伪门部分覆盖;提供(130)在EUV曝光时会氧化的抗蚀剂材料;将晶片暴露于EUV光(140);选择性地去除部分未曝光的抗蚀剂(6)并去除(150)伪栅极和未曝光的抗蚀剂(5);在功能层之间以及在第一端部(21)和第二端部(22)处在暴露的抗蚀剂(6)的其余部分之间形成(160)栅极。

著录项

  • 公开/公告号EP3567003A1

    专利类型

  • 公开/公告日2019-11-13

    原文格式PDF

  • 申请/专利权人 IMEC VZW;

    申请/专利号EP20180171948

  • 申请日2018-05-11

  • 分类号B82Y10;H01L29/40;H01L29/423;H01L29/66;H01L29/775;H01L29/06;

  • 国家 EP

  • 入库时间 2022-08-21 11:38:43

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