Hardened layer depth measuring device and hardened layer depth measuring method

摘要

PROBLEM TO BE SOLVED: To provide a hardened layer measurement device that allows for making measurements without having to wait for the temperature to return to a normal range from a high temperature after heat treatment.SOLUTION: A hardened layer measurement device includes; a computation unit 44 configured to compute a hardened layer depth of a work based on detection voltage output from a detection coil 2; and a correction unit 45 configured to perform correction to a hardened layer depth at normal temperature on the basis of the hardened layer depth during measurement computed by the computation unit 44 and a previously obtained relationship between work temperature during measurement and hardened layer depth. Since measurements at high temperature is enabled, it is no longer required to wait for a work to return to a normal temperature range, for example, 10 to 30°C before making measurement, which allows for making inline measurements.SELECTED DRAWING: Figure 13