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Devices and methods for a power transistor having a Schottky or Schottky-like contact

机译:具有肖特基或类肖特基接触的功率晶体管的装置和方法

摘要

Devices, structures, and methods thereof for providing a Schottky or Schottky-like contact as a source region and/or a drain region of a power transistor are disclosed. A power transistor structure comprises a substrate of a first dopant polarity, a drift region formed on or within the substrate, a body region formed on or within the drift region, a gate structure formed on or within the substrate, a source region adjacent to the gate structure, a drain region formed adjacent to the gate structure. At least one of the source region and the drain region is formed from a Schottky or Schottky-like contact substantially near a surface of the substrate, comprising a silicide layer and an interfacial dopant segregation layer. The Schottky or Schottky-like contact is formed by low-temperature annealing a dopant segregation implant in the source and/or drain region.
机译:公开了用于提供肖特基或类肖特基接触作为功率晶体管的源极区和/或漏极区的装置,结构及其方法。功率晶体管结构包括第一掺杂极性的衬底,在衬底上或内部形成的漂移区,在漂移区上或内部形成的主体区,在衬底上或内部形成的栅极结构,与衬底相邻的源区。栅极结构,与栅极结构相邻形成的漏极区。源区和漏区中的至少一个由基本靠近衬底表面的肖特基或类肖特基接触形成,该接触包括硅化物层和界面掺杂剂隔离层。肖特基或类肖特基接触通过在源极和/或漏极区域中对掺杂剂隔离注入进行低温退火而形成。

著录项

  • 公开/公告号US10510869B2

    专利类型

  • 公开/公告日2019-12-17

    原文格式PDF

  • 申请/专利权人 SILICET LLC;

    申请/专利号US201815927693

  • 申请日2018-03-21

  • 分类号H01L29/66;H01L27/095;H01L29/49;H01L21/78;H01L29/78;H01L29/10;H01L29/08;H01L29/423;H01L21/28;H01L21/225;H01L21/8238;H01L21/8234;H01L27/088;H01L29/872;H01L29/47;

  • 国家 US

  • 入库时间 2022-08-21 11:29:09

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